Processing

• Nano-Join sinter paste can be processed on Ni/Au, Ag, Cu
• Copper surfaces have to be pretreated with citric acid to remove copper oxide layer
• Thickness of layer of paste should be between 30µm and 200µm
• Paste has to be homogenised before application
• While sintering no pressure is needed but results are better especial for huge geometries
• Paste has to be stored at room temperature (even if already opened) at a dry, dark place